Product Assembly

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Electronic Product Assembly

Syrma SGS Technology provides printed circuit board (PCB), box build, electromechanical assembly, and full-systems integration. There are multiple Fuji SMT lines at our main facility with a total placement capacity of 200K components/hour with 40-micron placement accuracy capable of 3-sigma. Components range from 0201 to BGA and uBGA & CSP up to 55mm square; acceptable pitch placement is 12M. We manufacture boards up to 500x450mm with ceramic, flex, and rigid substrate board types. We also provide solder paste inspection (Koh Young, AOI, Vitrox), wave soldering (Electrovert, Ersa, Seho), conformal manual, automatic coating with multi-nozzle spray, and UV check chamber. We invest in state-of-the-art electronic product assembly equipment that provides optimal capacity utilization, passing savings in time and cost to our customers.

Our facilities use a semi-clean room environment for optical sensors. Our electromechanical capabilities include custom panels and electromechanical subassemblies via CNC horizontal and vertical machining centers with Amanda presses, press breaks, specialized bending machines, and turret punches. We facilitate precision plastic molding and other processes: electromechanical for CR, ferrous, HR, non-ferrous, pre-coated sheet, and aluminum materials with stamping (material thickness .25-9.98mm and part size from 2mm-3m). Casting and machining include pressure die casting in aluminum, Mazak (Zamak), hot or cold chamber die casting with part weight 1-500gm or 1½m by volume. Surface treatment includes anodizing process, electroplating (copper, silver, tin, and zinc), and powder coating.

PCBA Manufacturing Equipment

  • BGA repair station
  • Manufacturing defect analyzer (TRI-518)
  • Placement machines (Fuji, Universal, Yamaha)
  • Reflow ovens (Electrovert, Heller)
  • Router/depanelizer (manual & automatic systems)
  • Screen printers (MPM Accuflex)
  • Traceability software (Fuji Trax)
Syrma SGS TechnologyAssembly