Syrma SGS Technology refined the traditional ball grid array (BGA) repair & rework methodology to make the intricate rework process repeatable, consistent, and reliable. We offer full pad & trace repair services for boards and process troubleshooting of BGAs for initial assembly. Our certified technicians are experienced in analyzing mainstream assembly methods, such as surface mount and through-hole, and specialized processes, including BGA reballing and leadless chip carrier rework. Our technicians are IPC 7711/7721 certified and highly experienced in custom design solutions for both mainstream assembly methods and specialized processes, including BGA rework and reballing, leadless chip carrier rework, and PCB repair CCA rework, and jumper wire/white wire services.
Our services include pad & trace repair for boards with BGAs, troubleshooting issues during initial assembly, component removal, x-ray or optical verification, circuit design changes, and analysis and restoration of the printed circuit board assembly (PCBA), embedded firmware, and components. We re-test to ensure the return to original out-of-the-box functionality. Our automated tracking systems automatically document every step-by-step detail of the repair & rework process, such as subprocesses required, components replaced, and time stamping on unit packaging. All repair activity, including disassembly and reassembly, the sequence of repair, and parts and subassemblies replaced, is similarly tracked for full accountability to our clients.