We’ve refined the traditional ball grid array (BGA) repair & rework methodology to make the intricate rework process repeatable, consistent, and reliable. Our decades of experience keep us at the forefront of the latest package styles and techniques. We offer full pad & trace repair services for boards, as well as process troubleshooting of BGAs for initial assembly. Comprehensive repair & rework services, including pad & trace repair for boards with BGAs and process troubleshooting of issues during initial assembly. Our services include component removal, x-ray or optical verification, circuit design changes, and analysis and repair of the printed circuit board assembly (PCBA), embedded firmware, and components.
We re-test to ensure the return to original out-of-the-box functionality. Our automated tracking systems automatically document every step-by-step detail of the repair & rework process, such as subprocesses required, components replaced, and time stamping on unit packaging. All repair activity, including disassembly and reassembly, the sequence of repair, and parts and subassemblies replaced, is similarly tracked for full accountability to our clients.